Glenair D-subコネクタ, 25極, オス, スルーホール実装, GMR7590-25P-1BSN

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Micro D with Reduced 0.075 in. PCB Pitch

For higher densities of circuit tracks and reduced termination grid patterns. The 0.075 inch pitch Micro D connector significantly reduces connector size and weight. They share the same high performance components used in the rest of the Mil-PRF-83513 approved Micro D range and mate with the corresponding Glenair Micro D Metal flying lead or solder bucket connector.

High performance, gold plated twist pin contact system
3 amp contact rating
High density 0.05 inch contact pitch
RoHS compliant
0.075 inch termination grid
Nominally 23-43% reduction in pcb space required
Nominally 12-20% weight reduction
0.020 inch diameter copper termination tails
Vertical and horizontal mounting
Interfacial sealing gaskets fitted as standard
Nickel plated, precision machined shell housing with trapezoidal polarisation
Jackposts supplied installed.